electronic component machinery, unspecified

Contents

The data represent an average of three exemplary machineries used in the production of electronic components (a wafer marking system, a laser blind-via drilling system and a IC trim system). Material data are taken from producer information of these machineries. Infrastructure and production efforts are based on own assumptions. The dataset represents a machinery with a weight of 2’500 kg.

dataset

number 7097
timestamp 2010-06-16T17:38:25
validCompanyCodes CompanyCodes.xml
validRegionalCodes RegionalCodes.xml
validCategories Categories.xml
validUnits Units.xml
generator EcoAdmin 1.1.25.22
internalSchemaVersion 1.0

referenceFunction

unit unit
amount 1
includedProcesses This module includes material, production efforts (transportation, energy, process chemicals, …) and infrastructure for the production of a machinery used in the production line for electronic components. No information about emissions (air, water) and waste are included.
infrastructureIncluded true
datasetRelatesToProduct true

geography

location GLO
text This module relates to the global situation.

technology

Average of three current machineries sold for the production of electronic components (see general comments).

timePeriod

startYear 2005
endYear 2005

dataSetInformation

timestamp 2007-09-14T16:12:10
version 2.2